Laser machining system

  • Inventors: IWAMOTO JOJI
  • Assignees: Nikon Corp
  • Publication Date: May 20, 1988
  • Publication Number: JP-S63116481-A

Abstract

PURPOSE:To correctly detect a reduction in the energy of a laser beam by a method wherein the peak value and power value of a laser beam ate detected. CONSTITUTION:A laser beam L1 emitted by a laser oscillating device 2 is so controlled as to be steady at a prescribed value through the regulation of an attenuator by means of an attenuator controlling signal S4 supplied by a controlling section 17. In the path of the laser beam L1, beam splitters 4 and 5 are installed, whereby the laser beam L1 is split into laser beams L3 and L4. The beams L3 and L4 are led to a peak value detector 13 and power value detector 14, respectively. The detector 13 detects the peak value of the laser beam L3 for one laser making process and feeds the collected data into the controlling section 17. The detector 14 detects the average power value of the laser beam L4 and feeds the collected data into the controlling section 17.

Claims

Description

Topics

Download Full PDF Version (Non-Commercial Use)

Patent Citations (0)

    Publication numberPublication dateAssigneeTitle

NO-Patent Citations (0)

    Title

Cited By (9)

    Publication numberPublication dateAssigneeTitle
    EP-0625401-A3March 15, 1995Sumitomo Electric IndustriesLasersystem für ein Laserablationsverfahren und, dabei, Ablationsverfahren zum Vorbereiten eines dünnes Filmes aus oxidischem supraleitendem Material.
    FR-2682476-A1April 16, 1993Cheval Freres SaMethod for detecting and measuring the energy emitted by a laser source and device for its implementation
    JP-2009188031-AAugust 20, 2009Gigaphoton Inc, ギガフォトン株式会社レーザ装置の故障診断システム
    JP-2009291818-ADecember 17, 2009Disco Abrasive Syst Ltd, 株式会社ディスコレーザ加工装置及びレーザ加工方法
    JP-2010010274-AJanuary 14, 2010Miyachi Technos Corp, ミヤチテクノス株式会社Laser processing device
    JP-2010029909-AFebruary 12, 2010Tohoku Denshi Sangyo Kk, 東北電子産業株式会社レーザマーキング装置、及びレーザマーキングシステム
    JP-2010251448-ANovember 04, 2010Shimadzu Corp, 株式会社島津製作所Solid-state pulsed laser apparatus for output of third harmonic waves
    JP-2012076104-AApril 19, 2012Panasonic Electric Works Sunx Co Ltd, パナソニック電工Sunx株式会社Laser machining device
    US-5544182-AAugust 06, 1996Sumitomo Electric Industries, Ltd.Laser system for laser ablation process and laser ablation process for preparing thin film of oxide superconductor material thereby